05/Mar/2020 | 84798939 | 0 # & temporarily presses the s / p layers (plastic, copper) together before the heat press for printed circuits, model: hbm-02.�220v 50hz 3p.�(used bonding m / c (hbm-02) (s / n: hbm-k01)), produced in 2018, manufacturer: supex bnp | Korea (Republic) | 1 | set | 25,514 | ***** | 34 More Columns Available along with Company Name and Other Details etc. |