30/Nov/2017 | 3907300000 | Polymer materials based on epoxy resin, in the form of tablets 14 mm in diameter, used in the manufacture of integrated circuits, not contain ethanol and ozone-depleting substances composition: silicon dioxide 65-75%, epoxy resin 10-20% | JAPAN | KYOCERA | *** | *** | 1,080 | 34377,08 | ***** | 84 More Columns Available along with Company Name and Other Details etc. |