Brazil Shipment Data and Price of Of Imports under NCM Code 39073019
Search Brazil shipment data and market research report on of imports under NCM Code 39073019 and check market price of of. View market share of companies importing of under NCM Code 39073019
24 Shipments Records (Demo)
39073019 
| Date | NCM Code | Product Description | Origin Country | Quantity | Value | Importer Name | Click to view 16 more columns 16 More Columns Available |
|---|---|---|---|---|---|---|---|
| Jan/2019 | 39073019 | Epoxi resin, used as starting material in products for the building trade. brand: korea re, species: liquid, trademark: kor- prime- cjs. of 15kgs. sap code: 19645 | SOUTH KOREA | 180 | 1,135.80 | ***** | 16 More Columns Available along with Company Name and Other Details etc. |
| Jan/2019 | 39073019 | Mdcge110bh83 fc-plastic composite in epoxy base used in process encapsulation integrated circuit technology type flip-chip, stats acid pellets (pellets) of 14 mm diameter and a weight of 4.4 g. | JAPAN | 700 | 62,510 | ***** | |
| Jan/2019 | 39073019 | 22b01234 - epoxy resin load - physical form: viscous - when mixed origin dao an on electrically conductive and duct - lot: 5053/17/5054/17 cc kit with 0, 026kg - 2cc part of a + cc 2 of part b) - used in post inteligent fabricacao | UNITED KINGDOM | 250 | 15,450 | ***** | |
| Jan/2019 | 39073019 | Mdcsg8500begranu epoxy resin molding, compound of silica blown, epoxy resin, phenolic resin and carbon black, willing granules used in molding process for encapsulation of integrated circuits memory | SOUTH KOREA | 260 | 21,320 | ***** | |
| Jan/2019 | 39073019 | 0023811 epoxy resin net for encapsulation of ignition coil the par internal insulation of wires copper | JAPAN | 12,250 | 43,229.37 | ***** | |
| Jan/2019 | 39073019 | A2038073 - resin epoxy load - physical form: viscous - when mixed dao rise to an on electrically conductive and duct - ea044 part a / b 2 cc (2cc of part a + 2 cc of part b) - used in the post of manufacture intelligent combi - interface | GERMANY | 4.20 | 9,982.33 | ***** | |
| Jan/2019 | 39073019 | Gen12087 plastic composite epoxy base used in process encapsulation integrated circuit technology type flip-chip, stats acid pellets (pellets) of 14 mm diameter and a weight of 4.4 g - ge-mold compound 110bh83 x 5.8g -fc 14nm | JAPAN | 45 | 4,018.50 | ***** | |
| Jan/2019 | 39073019 | Cod: we-51-3375. description in portuguese: epoxy resin - load - other. name: low voc grind vehicle. description material technical: aqueous epoxy resin solution. physical form of product presentation: liquid. class: resin. process | United States of America | 1,995.83 | 5,149.05 | ***** | |
| Jan/2019 | 39073019 | Weber.guard pur primer 710 - resin one component polyurethane, colorless, scattered in solvent for purposes of sealing the concrete anchorage system. | GREECE | 12 | 58.56 | ***** | |
| Jan/2019 | 39073019 | Pn: 5542970; fat: 00102726426; 10 units sticker expoxi dp100fr-50ml off-white. for aircraft maintenance in - mpn: dp100fr. | ARGENTINA | 10 | 209.15 | ***** |
