29/Nov/2017 | 7410210000 | Dielectric flexible composite, foil (refined copper) into a sheet, is composed of polyimide film and laminated with two side of the copper foil thickness of 18 microns. (0.018 mm.) are intermediates for flexible printed circuit board | *** | PYRALUX | *** | *** | 81.96 | 55856,45 | ***** | 84 More Columns Available along with Company Name and Other Details etc. |
28/Nov/2017 | 7410210000 | Catalog base laminate foil: stf 1-18-0, 18 ikl 11kg; stf 2-18-0, 13 ikl 58, 5kg; stf 2-18-0, 18 ikl 121, 5kg; stf 2-18-0, 35 ikl 29, 5kg; stf 2-35-0, 2 ikl 103kg; stf 2-35-0, 3 ikl 3.5kg; sf-1-35g-1, 5 ikl. 509kg; sf-2-50g-1, 5 ikl. 314kg; | *** | PLANT Moldavizolit | *** | *** | 1,671.66 | 31285,93 | ***** |
22/Nov/2017 | 7410210000 | The base material for printed circuit boards: copper foil into a dielectric substrate (epoxy resin and glass) | *** | ISOLA | *** | *** | 2,892 | 42457,44 | ***** |
22/Nov/2017 | 7410210000 | Insulator foil is flexible, thicker. (excluding any backing) not bol. 0.15 mm intended for construction show-ya pcb, gross weight from the pallet - 72.82 kg | *** | ABSENT | *** | *** | 50 | 1869,5 | ***** |
16/Nov/2017 | 7410210000 | Copper foil, coated on one or both sides of the basic dielectric material (glass fiber laminate) - foiled dielectrics, in sheets - 4, 740 sheets. characteristics: thickness of copper foil - from to 0.018mm 0.035mm. goods packed in | *** | ABSENT | *** | *** | 15,356 | 121247,8 | ***** |
08/Nov/2017 | 7410210000 | Catalog base laminate foil: ssfv-1-35-1, 0 1kl (224kg) 30listov.. | *** | PLANT Moldavizolit | *** | *** | 251.56 | 42596,84 | ***** |
30/Oct/2017 | 7410210000 | Catalog base laminate foil: sf-1-35g-1.5 ikl. 500kg. | *** | PLANT Moldavizolit | *** | *** | 4,715.62 | 82095,08 | ***** |
24/Oct/2017 | 7410210000 | Insulator foil is flexible, thicker. (excluding any backing) not bol. 0.15 mm intended for construction show-i printed circuit board | *** | ABSENT | *** | *** | 50 | 7898,59 | ***** |
24/Oct/2017 | 7410210000 | Foil from refined copper from the base thickness (excluding any backing) not exceeding 0.15 mm, copper foil is refined for manufacturing printed circuit boards for the electronics industry, mechanical engineering, etc. | *** | ITEQ | *** | *** | 2,262 | 17250,21 | ***** |
23/Oct/2017 | 7410210000 | Ftoroplastovye sheets armirovannye folgirovannye. present soboy folgirovanny dielekrik as material osnove polifenilenoksida c d | CHINA | *** | *** | *** | 50 | 458,2 | ***** |