30/Nov/2017 | 3907300000 | Polymer materials based on epoxy resin, in the form of tablets 14 mm in diameter, used in the manufacture of integrated circuits, not contain ethanol and ozone-depleting substances composition: silicon dioxide 65-75%, epoxy resin 10-20% | JAPAN | KYOCERA | *** | *** | 1,080 | 34377,08 | ***** | 84 More Columns Available along with Company Name and Other Details etc. |
30/Nov/2017 | 3909200000 | Polymer material melamine resin in the form of tablets white 14 mm diameter, 1 / 3.8 d used in manufacturing integrated circuits cleaning mold process after encapsulation not contains ethanol and | JAPAN | KYOCERA | *** | *** | 90 | 3580,47 | ***** |
27/Nov/2017 | 3923900000 | Antistatic foam 220-18.7-3.9 (length = 220 + -1.5 mm) -10000 pcs. (complete with cover) .insert electronic industry to packaging and transportation of integrated circuits and optocouplers. not apply to food promyshlennosti.sostav: | CHINA | ABSENT | *** | *** | 81 | 2,660 | ***** |
08/Nov/2017 | 3923100000 | Satellites carrier of plastic in the shape of a box with a lid, is used as transportation containers for integrated circuits, tex. characteristics: number of cycles "mounting and removing" at least 30 times, storage life of 5 years, the tray and the no boxes | UKRAINE | LTAVA | *** | *** | 9 | 1786,2 | ***** |
30/Oct/2017 | 3919900000 | Self-adhesive three-layer film (made of polyethylene, the adhesiveness of the adhesive layer and pvc) is designed to fix, transport and handling of semiconductor crystals in the production process (dicing) of integrated circuits. | JAPAN | DENKA ADTECS | *** | *** | 7 | 1024,85 | ***** |
30/Oct/2017 | 3917330009 | Tubes, pipes and hoses, not reinforced or not combined with other materials, with fittings. accessories ventilators ivent. disposable adult respiratory circuits, y-type, 1.8 m, line with integrated pressure | UNITED STATES | *** | 20,00 | KG | 20 | 1365,22 | ***** |
05/Oct/2017 | 3926909200 | Other thermoplastic products made of sheet material intended for use in electrotechnical assemblies general purpose: the thermal conductivity of mats (polyamide) for radiators integrated circuits and transistors, rectangular shape | GERMANY | *** | 0,30 | KG | 0.30 | 170,22 | ***** |