18/Sep/2017 | 8464100000 | Cutting machine, disc, for processing wafers and substrates for microplates, the size of the processed material, 60h48 mm, thickness of 0.25 - 2 mm, speed 5000-50000 / min, air flow 185 l / min, air pressure 5.5 bar , water consumption (basic cs | UNITED KINGDOM | *** | 813,24 | KG | 813.24 | 236227,83 | ***** | 84 More Columns Available along with Company Name and Other Details etc. |