30/Oct/2017 | 8486209001 | Setting exposure uv-c is used. processes svet.izlucheniya powatec u-201-1sht. designed to remove zischitnoy tape adhesive film to a semiconductor wafer. apply microelectronics industry. | SWITZERLAND | POWATEC | 1 | PC | 20.80 | 15631,15 | ***** | 84 More Columns Available along with Company Name and Other Details etc. |
18/Sep/2017 | 8486400009 | Device for manufacturing semiconductor devices filler (dispensers) filler, b-800 solder paste and adhesive, volt supply voltage 220, includes a controller, control pedal, syringes, intended for continuous dosing and application | CHINA | *** | 9,7 | KG | 9.70 | 1852,92 | ***** |
12/Sep/2017 | 8486400009 | Other machinery and equipment. not for military purposes. not for medicine. device for automatic point solder paste, adhesives, protective materials and other materials, the point of attachment components and assemblies during the assembly process printed | NETHERLANDS | *** | 1,380 | KG | 1,380 | 182852,02 | ***** |